According to latest stastics of DIGITIMES, excluding two IC design industry, in 2012 the world's top 10 semiconductor manufacturers are Intel (Intel), Samsung Electronics (SamsungElectronics), TSMC, Texas Instruments(TexasInstruments), Toshiba (Toshiba), Renesas the Electronics (RenesasElectronics) of SK Hynix (SKHynix) and STMicroelectronics. Observed from 2012 to 2013 semiconductor companies changes in capital expenditures, Intel and TSMC will increase over 2012, Samsung Electronics, Toshiba are expected to keep flat, SK Hynix will be less compared to that of 2012, as adopted fab-lite strategy Renesas Electronics, Texas Instruments and STMicroelectronics in 2013 will continue to maintain the low capital expenditure. In 2013 Intel's Capital expenditure compared to 2012 increased by 18.2%, reaching $ 13 billion, in addition to the continuous improvement of 22nm process accounted for the proportion of production capacity, will also be put into the more advanced 18-inch wafer 14,10,7,5 nano process R & D better production performance processor.Samsung Electronics semiconductor industry capital spending continued to increase since 2009, only $ 3.2 billion to $ 12.3 billion in 2012, for three consecutive years of growth, and then in 2013 is forecast to reduce slightly to $ 12 billion, the investments focus of its memory business continued to improve the DRAM 28 -nanometer process accounted for the proportion of production capacity, continued construction of the continent Xi'an NANDFlash the new plant, and to promote NANDFlash toward the 21,16-nanometer process forward, and system IC business will be to expand Austin, Texas factory production and restart Han Guohua City plant 17 production line the main construction project. In 2013, TSMC's capital expenditure will increase from $ 8.3 billion in 2012 to 95 billion to $ 10 billion, mainly for provisioning 28,20 and 16 nanometer process capacity. Japanese factory Toshiba 2013 capital expenditures are expected to be flat at $ 2 billion, will be used primarily invested NANDFlash1y nano-process research and development.SK Hynix capital expenditure continued to increase since 2009, only $ 800,000,000 to $ 3.5 billion in 2012, showing three consecutive years of growth trend, then 2013 is expected to decrease to $ 2.6 billion. 2013 SK Hynix will not only promote its DRAM upgrade from 35 nm to 28 nm process NANDFlash upgrade from 27 nm 21 nm process, the more high-end chip production plans to cut its foundry production line.
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