In 2009, TI built the industry's first 300mm wafer fab for analog chips, the semiconductor industry has changed this situation.Until then, the analog chip manufacturing using a 200mm wafer and smaller size. 300mm fab in Lane, TI can get more favorable than its competitors die-size and cost advantages. In theory, a number of chips provided 300mm wafers of 200mm wafers more than 2.5 times, thereby reducing the overall manufacturing cost of TI. In the past year, Infineon and STMicroelectronics have begun to step up their planning for the analog chip 300mm fabs. And seek to fill the missing gaps clients wafer fab and light way, GlobalFoundries is capable of providing 300mm capacity for analog / mixed-signal technology, the finest manufacturers. "TI has these technologies and is also 300mm horizontal," recently Globalfoundries global sales, marketing, quality and design of the Deputy Executive MichaelNoonen said. "How do talent and TI comparable? We want is the answer to this question."In this ever-changing situations, Powerchip, TowerJazz, TSMC and UMC have begun preparations to provide 300mm analog chip production capacity. But most of the professional 300mm wafer fab foundry no, and that they are not at a disadvantage. They believe that the process-oriented simulation, does not depend on the size of the wafer. TI, Infineon and STMicroelectronics are few production capacity with 300mm analog / digital hybrid fab in the elite enterprises. No other analog IDM 300mm fab, which means that they must deal with these companies, if they need larger foundry.In a way, GlobalFoundries, Powerchip Semiconductor, TSMC and UMC have professional 300mm production capacity. GlobalFoundries, TSMC and UMC also the pursuit of the leading digital market. "We really want to have two types of SoC," GlobalFoundries the noonen said. "At the forefront of the SOC Then, another SOC is the pursuit MoreThanMoore (the CMOS technology and analog / mixed-technology combined), this is interesting."