With smart phones, tablet computers rise, small, fast, light, power trend for mobile devices, pushing up the three-dimensional chip (3DIC) high demand, opening a new trace of the semiconductor industry.Foundry ,Taiwan Semiconductor Manufacturing Company (2330) has programmable logic chip maker Xilinx (Xlinx) FPGA chip production, packaging and testing plant UMC and ASE, SPIL, PTI also added amount lineup; Equipment Factory Philip plastic, are China product packaging and bonding force equipment, but also to import client validation.Japan's Sony latest flagship models waterproof mobile phone XperiaZ, which had been used 3DIC image sensor chip manufacturing process, becoming a new image sensor chip benchmark. 3DIC of manufacturing processes to create the three high efficiency: high-performance, high-density and high portability, play trendsetting effects, transforming the semiconductor industry thinking, domestic manufacturers rushing into the three-dimensional stack image sensor market.ITRI director ,Liujun Ting said the hospital was awarded the gold medal at this year's 3DIC Extension Service Award three-dimensional chip integration technology and to promote, through five years of sustained effort, not only to set up research and development of advanced systems and applications stack Union (Ad-STAC) to midstream and downstream related industries to establish cooperative relations, but also with the launching Ares interdisciplinary cooperation, the successful series of international manufacturers, and domestic fab to packaging and testing and upstream industries, promote equipment and materials to achieve localization, so that Taiwan has the opportunity with international competition and create the next wave of industrial competitiveness.This wave of emerging trends in component miniaturization, attract TSMC, UMC, ASE, SPIL, PTI, were China, Hong plastic, force plot and Applied Materials, Han and other semiconductor front-end and back-end vendors, actively involved in the layout.ITRI leading developer of "BacksideVia-last" technology solutions for chip wafer front perforation process and may create bottlenecks in the process and reduce the production cost, attract Intel (Intel) inputs, use 3DIC technology to develop new generations of memory, the establishment of 3DIC products and expand the application market.
EC4
ET1 Dipped CA42
Coin Type