Benefited from a wave of smart phones and tablet, and product volume production of new machines listed one after another in the second half, the MIC data shows that in 2013 the global semiconductor market to recover, we expect 4-5% growth momentum, the overall market is not bearish, is expected to have significant growth. However, the Institute for Information Industry Information Industry Consultant and Director Chunhui, said: "From a regional market, the Asia-Pacific region is the largest source of demand for the semiconductor market, especially the Chinese white card needs more obvious; As for Taiwan's semiconductor industry, is also quite optimistic forecast of 13% growth, which bottomed out in memory is expected to have a more substantial growth. " As for the foundry, IC design and IC packaging and testing parts, Chunhui mentioned foundry in the advanced process, driven by the growth of 15%, IC design grew 9%, while the IC packaging and testing is also stable growth of 8% . Moreover, Taiwan's IC design industry but also because of the low-cost smart phones, tablets and TV into the 4K2K and laptops, PC equipped with a touch-proportional increases and other factors, expected in the second and third quarters in succession related products manufacturer with clients listed on the new machine production, Operating estimated peak fall in the third quarter. In design terms, starting in 2012 with the Chinese mainland and the driver IC Korean customer shipping buoyant effect, the proportion increased steadily quarter by quarter, and the proportion of the first quarter of 2013 also further beyond logic chips multimedia, communications, driver IC and multimedia logic chips in Taiwan IC design three main products. Foundry parts, Taiwan advanced 28/40nm foundry percentage of the GDP in the second quarter of 2013 is expected to reach 4 percent, which was mainly driven by the underlying demand 28nm, 40nm foundry output is flat. However, Taiwan's turn into 28nm foundry products and more in the first half of 2013, an estimated half of the growth rate will gradually slow down. The 40/45nm and 40/90nm competitors quite a bit, and turn into the process faced, OEM prices face downward pressure. In addition, IC packaging and testing, although growth slow, but still continued to grow, the third quarter is expected to peak in the second half than the first half of 2013 is expected to grow by about 13%. Terminal application products to mobile communications products and panel driver IC highest growth, smart phone market growth has also led to the demand for advanced packaging processes.
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