According to the final statistics released by the International Research and advisory firm ,Gartner,in 2012 output value of the global semiconductor packaging and testing market (SATS) totaled $ 24.5 billion, representing a growth of 2.1% over 2011. Compared to the global semiconductor market last year's recession compared to the previous year , IC packaging and testing the market's growth is not as strong foundry, but still maintain a slight growth, as the industry is very optimistic about the strong demand for mobile devices, the outlook look forward to this year, the industry generally estimated this year IC packaging and testing market annual growth rate of up to 5 to 7%. Gartner research's vice president, Jim Walker said that in 2011 semiconductor packaging and testing market is of relatively modest growth, the annual growth rate of 1.8% in 2012 to maintain the slow pace of growth. PC market weakness continuation from 2011 to 2012, the overall decline in consumer demand as a result of semiconductor packaging and testing market slowdown, weak demand for semiconductor equipment to improve the annual inventory. According to Gartner statistics, the ASE closes to $ 4.4 billion on revenue of retaining its position in 2012 as the leading packaging and testing industry, which encapsulates accounted for the overall package of ASE / test / materials (ATM) revenue 80.5%. ASE, SPIL and other packaging and testing industry the active layout Copper wire process conversion, Amkor (Amkor) to maintain the location of the second giant, but in 2012 revenue to decline slightly by 0.6% to $ 2.76 billion. SPIL ranked third last year, revenue was $ 2.186 billion, an annual growth rate of about 8%, 90% of its revenue comes from packaging, 10% from the test. Fourth star ChipPAC (STATSChipPAC), is the fourth-largest chip packaging manufacturers Gartner statistics, revenues of $ 1.702 billion last year, still a slight decline of 0.3% the year before. Different packaging and testing industry, ranked fifth in Powertech Technology revenue from the memory of the semiconductor market, the scale of last year's revenue of $ 1.408 billion. Gartner statistics market size of the global IC packaging and testing last year amounted to $ 24.526 billion, compared with $ 24.024 billion in 2011, a growth of only 2.1%. The report noted that another cause the 2012 semiconductor packaging and testing market slowdown, semiconductor packaging and testing market and integrated device manufacturers (IDMs) packaging capacity over-investment in 2010 and 2011. Excess supply of the equipment manufacturer Advanced Packaging and traditional packaging production, not only weakened the bargaining power of the 2012 outsourcing vendors, and also reduce the overall industry capacity utilization. However, due to the gold wire rapid conversion to copper wire packaging process, packaging and testing market is still to be in a slow growth environment, reduce the cost of packaging process. The growth momentum in 2012 flip chip (Flipchip,) and wafer level packaging (WLP) technology at IC packaging and testing of the top five manufacturers in the market growth momentum, the strong demand from mobile devices this year, the industry generally forecast this year, IC packaging and testing market year The growth rate will be up to 5 to 7%.
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