Semiconductor Equipment and Materials International (SemiconductorEquipmentandMaterialsInternational, SEMI) said semiconductor technology moves towards systematic ,integration of different chips stacked in 3DIC (three-dimensional stacked die) will become a mainstream trend, from design tools, manufacturing, packaging and testing of all Process solutions of 2.5DIC are generally ready ,it is expected 2.5DIC official mass production will start in 2014. The president of SEMI in Southeast Asia ,Terry Tsao said , 2.5D and 3DIC process solutions have been matured, the industry currently facing the biggest challenge is how to enhance the production capacity, the industry estimates 3DIC is expected to formally mass production in the next two years . According to TechNavio recently released analysis and forecast, 2012-2016 3DIC global market compound annual growth rate of 19.7%, mainly contributed by the growth of mobile computing devices significant increase in memory requirements, 3DIC can improve memory performance and reliability of the product and can help reduce costs and reduce product size, including today's global TSMC (2330), ASE (2311), STMicroelectronics, Samsung, Elpida, Micron, Intel and other companies have been put into the development and production 3DIC .
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