According to the Japan Electronics Industry Association circuit's (JapanElectronicsPackagingCircuitsAssociation; JPCA) latest statistics ( with employees in more than 50 companies for statistical object ) , in November 2013 the Japanese printed circuit board (PCB; hard board + board + soft mold group substrate ) yields fell compared with the same month last year by 12.6% to 1.149 million square meters , the 15th consecutive month recession ; yield fell 3.7% to 42.18 billion yen , the second consecutive month showing decline. Cumulative January-November 2013 PCB production in Japan fell 22.9 percent from a year earlier to 1,195.6 million square meters , the yield decline by 16.9% to 4,521.28 billion yen. On the species , the November Japan hard board (RigidPCB) production growth compared to the same month last year by 2.4% to 912,000 square meters , the second consecutive month to show growth ; yield fell 0.3 % to 27.22 billion yen , the first three months degree show decline. FPC (FlexiblePCB) yields greatly reduced by 48.5% to 188,000 square meters , the 13th consecutive month showing decline; yield fell 20.8 percent to 5.485 billion yen , the 13th consecutive month showing decline. Module substrate (ModuleSubstrates) yields decline by 16.9% to 49,000 square meters , the yield fell 1.3 percent to 9.475 billion yen .Cumulative January-November 2013 , Japan hardboard production fell 1.3 percent from a year earlier to 9.412 million square meters , the yield decline by 12.8% to 3,010.12 one hundred million yen ; soft board production declined significantly by 51.8% to 2.015 million square meters , yield fell 26.5 percent to 55.889 billion yen ; module substrate production decline 25.8 percent to 530,000 square meters , the yield decline by 22.4% to 95.227 billions yen .
EC4
ET1 Dipped CA42
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