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At Q2 Taiwan's IC Industry Output Grew 16.8%
Date: 2014-01-02
ITRI ​​IEKITIS Project has published the latest statistics report noted that in 2013 the second quarter of Taiwan's IC industry output (including design, manufacturing, packaging, testing) was NT $ 4,800 million, representing a substantial growth in the first quarter of 2013 by 16.8%. Taiwan's IC design industry performance benefited from mainland China cheap smart handheld devices and consumer electronics products buoyant demand, compared with the first quarter of 2013 increased by 20.2%, as the best performer.First observation of IC design industry, although the global PC / NB market volume continued to decline, but because of the global low-cost smartphones, tablet devices and other products selling well in mainland China under the effect of the summer up the goods in advance and stimulate domestic chip smart handheld devices industry revenue growth. The second quarter of 2013 the output value of Taiwan's IC design industry to NT 1,216 million, compared with 2013 growth of 20.2% in the first quarter significantly. Taiwan's overall IC manufacturing part of the second quarter of 2013 is still strong demand for mobile communication devices by incentives, such as the application processor, baseband chip, Wi-Fi, and mobile memory requirements with a large outbreak, the overall IC manufacturing output in the first quarter grew by 16.7%, the output value of NT $ 2,538 million, of which both in the manufacture of foundry or memory, it also has a significant double-digit growth.Taiwan's IC packaging and testing industry section, the second quarter of 2013 grew 13.4% year over year growth of 4.4%. Benefiting from customer orders return of communications chips, packaging and testing industry driven by the overall performance of the second quarter, with revenues of upstream foundry strong rebound in the second quarter, supporting the IC packaging and testing plant orders. In addition, the depreciation of the NT dollar turn, makes the IC packaging and testing industry capacity enhancement orders, while the international price of gold fell, but also conducive to gold wire bonding machine material costs, improve industry margins.The second quarter of 2013 the output value of Taiwan's IC packaging NT $ 72.4 billion, representing a growth of 14.0% in the previous quarter, the output value of Taiwan's IC testing industry NT $ 32.2 billion, representing a growth of 12.2% in the previous quarter.
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